ce work en-ciency is higher.
Product Specification :
Model: Automatic positioning tin-plating platform for the mid-level motherboard
Item name: iBGA Max
Size: 97*76*20mm
N.W.: 300g
G.W.: 380g
Scope of Application: Perfect iPhone X/XS XS MAX/11/11 Pro/11 Pro Max motherboard box RF small board positioning, Tin-plating repair application.
Package includes :
1 Set Tin-plating Platform