con HI6290/L, Qualcomm SM8250-102 small, Qualcomm SM8250-202 large, Qualcomm SM8350/Snapdragon 888, Snapdragon 845/SDM845, Snapdragon 855/SM8150, Kirin 9000 HI36A0, EMMC/EMCP/UFS BGA153.
Option:
1. Z21 MAX for iPhone.
2. Z21 MAX for Android.
3. Z21 MAX for iPhone and Android
Features:
1. High-temperature resistance and abrasion resistance.
2. impored alloy steel, metl fatigue resistance, make the product more durable.
3. Dirt-resistant, easy to clean.
4. High precision, Precise alignment Each