stage supercharging brushless pump, air pressure stability, long life.
5.Set the parameters such as temperature, air velocity and time.
6.Ceramic heating element, plug type design.
De-soldering of the SMD components, such as SOIC, CHIP, QFP, PLCC, BGA and so on.
Suitable to hot shrink, drying, remove lacquer and mucosity, thaw, preheating, disinfect and so on.
Suitable to the situation with different grade airflow.
Suitable to the hot air lead free de-soldering.